Send Message

Leave a Message

We will call you back soon!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Your message must be between 20-3,000 characters!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Please check your E-mail!

SUBMIT

More information facilitates better communication.

Mr.
  • Mr.
  • Mrs.
OK

Submitted successfully!

We will call you back soon!

OK

Leave a Message

We will call you back soon!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Your message must be between 20-3,000 characters!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Please check your E-mail!

SUBMIT
Please leave your correct email and detailed requirements.
OK
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
  • Home
  • Products
    Panel Level Packaging Form
    Panel Level Packaging Chip
    Panel Level Packaging Product Structure
    Fan Out Panel Level Packaging
    TGV Through Glass Via
    Packaging Simulation Experiments
  • Videos
  • About Us
    About Us
    Factory Tour
    Quality Control
  • Contact Us
English
  • English
  • French
  • German
  • Italian
  • Russian
  • Spanish
  • Portuguese
  • Dutch
  • Greek
  • Japanese
  • Korean
Chat Now
Home

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. products online

Catagories
  • Panel Level Packaging Form(3)

  • Panel Level Packaging Chip(4)

  • Panel Level Packaging Product Structure(4)

  • Fan Out Panel Level Packaging(5)

  • TGV Through Glass Via(7)

  • Packaging Simulation Experiments(1)

Contacts
Contacts: Mr. LIN TINGYU
Tel: +8615358053318
Chat Now
  • Good price Package Suitable For Various Packaging Simulation Experiments online

    Package Suitable For Various Packaging Simulation Experiments

    Get Best Price
  • Good price Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen online

    Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen

    Get Best Price
  • Good price Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test online

    Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test

    Get Best Price
  • Good price High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips online

    High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips

    Get Best Price
  • Good price high aspect ratio TGV Foundary Capabilities for semiconductor packaging online

    high aspect ratio TGV Foundary Capabilities for semiconductor packaging

    Get Best Price
  • Good price High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm online

    High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm

    Get Best Price
  • Good price Glass Substrate Technology-Plating Double Side Stable And Easily Maintain online

    Glass Substrate Technology-Plating Double Side Stable And Easily Maintain

    Get Best Price
  • Good price 12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness online

    12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP)  Power Package online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF) online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED

    Get Best Price
  • Good price Fan-Out Panel Level Packaging  (FOPLP)  Product Structure Embedded Package online

    Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package

    Get Best Price
  • Good price Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability online

    Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

    Get Best Price
  • 1
  • 2
  • >
  • >>
About
Home Products About Us Sitemap Mobile Site Privacy Policy
Panel Level Packaging Form
  • Panel Level Packaging Panel Level SiP Used In Various Industries

  • 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

  • 310*320mm Panel Size Panel Level QFN Low Electrical Resistance

Panel Level Packaging Chip
  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip(Silicon)

  • LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

  • 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Follow Us
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
+8615358053318
tingyulin@fzxsmc.com
Mail Us
China Good Quality Panel Level Packaging Form Supplier. © 2024 fozhixinsmc.com. All Rights Reserved.
Welcome to fozhixinsmc.com
fozhixinsmc.com asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
Consent Do not consent